I will design a temperature monitoring system using the FRDM-KL25Z board and multifunction shield that constantly displays the temperature, raises an audible alarm, and flashes a light when the temperature reaches or exceeds the critical temperature of 82 degrees Fahrenheit.
The temperature monitoring system I will design utilizes the FRDM-KL25Z board and multifunction shield to provide a comprehensive solution. The system will continuously display the temperature, allowing users to monitor the environment easily. When the temperature exceeds the critical temperature of 82 degrees Fahrenheit, the system will activate an audible alarm and simultaneously flash a light specifically designed for the hearing impaired. This ensures that the alarm is noticeable to all individuals, regardless of their hearing abilities.
By employing the FRDM-KL25Z board and the multifunction shield, I can leverage the board's processing capabilities and the shield's additional features to create a reliable and efficient temperature monitoring system. The system will constantly read and update the temperature data, displaying it on the built-in screen. It will also continuously compare the temperature reading with the critical temperature threshold.
When the temperature surpasses or equals the critical temperature, the system will activate the audible alarm, generating a distinct tone that alerts users to the potentially hazardous condition. Additionally, the system will trigger the light on the multifunction shield to flash, providing a visual indicator for individuals with hearing impairments.
This design ensures that users can monitor the temperature of their environment effectively. It provides a clear and visible display, an audible alarm for auditory alerts, and a flashing light to accommodate individuals with hearing impairments. With its robust features and reliable performance, this temperature monitoring system offers a comprehensive solution for maintaining awareness and safety in critical temperature conditions.
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The temperature monitoring system using the FRDM-KL25Z board and multifunction shield will constantly display the temperature, generate an audible alarm, and flash a light when the temperature exceeds the critical temperature of 82 degrees Fahrenheit.
To design the temperature monitoring system, we will utilize the FRDM-KL25Z board and the multifunction shield. The system will continuously monitor the temperature of the environment and display it on the chosen output device, such as an LCD screen. The temperature sensor connected to the board will provide real-time temperature readings.
In order to raise an alarm when the temperature exceeds the critical temperature of 82 degrees Fahrenheit, we will implement a conditional check in the system's programming. Once the temperature reaches or exceeds the critical level, the system will trigger an audible alarm by generating a specific tone through a speaker or buzzer. Simultaneously, a light, such as an LED, will be activated to flash, providing a visual signal.
The combination of the audible alarm and flashing light ensures that both individuals with hearing abilities and the hearing impaired are alerted when the critical temperature is reached or exceeded. This design prioritizes safety by providing multiple means of notification, allowing prompt actions to be taken to address any potential issues arising from high temperatures.
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A Satellite at a Distance 30,000 Km from an Earth Station ES Transmitting a T.V Signal of 6MHz Bandwidth at 12 GHz and a transmit Power of 200watt with 22 dB Gain Antenna. if the ES has an Antenna of 0.7m in Diameter & Overall Efficiency 65 % at this Frequency. assuming a System Noise Temperature of 120k. and Consider the Boltzmann's Constant is 1.38 X 10 -23
Compute the Following:-
1. the Gain Of the ES Antenna
2. the Path Loss Associated with this Communication system
3. the EIRP and the Received Power at ES
4. the Noise Power
the Signal- to - Noise Ratio at the ES
The gain of the Earth Station (ES) antenna can be calculated using the formula: Gain (dB) = 10 * log10(η * π * (D/λ)²), where η is the overall efficiency (0.65), D is the diameter of the antenna (0.7 m), and λ is the wavelength.
The path loss can be calculated as Path Loss (dB) = 20 * log10(d) + 20 * log10(f) + 20 * log10(4π/c), where d is the distance (30,000 km), f is the frequency (12 GHz), and c is the speed of light.
The EIRP is the sum of the transmit power (200 W in dBW) and the antenna gain. The received power at the ES is the EIRP minus the path loss.
The noise power can be calculated using Noise Power (dBW) = k * T * B, where k is Boltzmann's constant, T is the system noise temperature (120 K), and B is the bandwidth (6 MHz). The signal-to-noise ratio (SNR) at the ES is obtained by subtracting the noise power from the received power.
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A centrifugal pump, located above an open water tank, is used to draw water using a suction pipe (8 cm diameter). The pump is to deliver water at a rate of 0.02 m3/s. The pump manufacturer has specified a NPSHR of 3 m. The water temperature is 20oC (rho = 998.23 kg/m3) and atmospheric pressure is 101.3 kPa. Calculate the maximum height the pump can be placed above the water level in the tank without cavitation. A food process equipment located between the suction and the pump causes a loss of Cf = 3. All other losses may be neglected.
To calculate the maximum height the pump can be placed above the water level without experiencing cavitation, we need to consider the Net Positive Suction Head Required (NPSHR) and the available Net Positive Suction Head (NPSHA).
The NPSHA is calculated using the following formula:
NPSHA = Hs + Ha - Hf - Hvap - Hvp
Where:
Hs = Suction head (height of the water surface above the pump centerline)
Ha = Atmospheric pressure head (convert atmospheric pressure to head using H = P / (ρ*g), where ρ is the density of water and g is the acceleration due to gravity)
Hf = Loss of head due to friction in the suction pipe and food process equipment
Hvap = Vapor pressure head (convert the vapor pressure of water at the given temperature to head using H = Pvap / (ρ*g))
Hvp = Head at the pump impeller (given as the NPSHR, 3 m in this case)
Let's calculate each component:
1. Suction head (Hs):
Since the pump is located above the water level, the suction head is negative. It can be calculated using the formula Hs = -H, where H is the vertical distance between the pump centerline and the water level in the tank. We need to find the maximum negative value of H that prevents cavitation.
2. Atmospheric pressure head (Ha):
Ha = P / (ρ*g), where P is the atmospheric pressure and ρ is the density of water.
3. Loss of head due to friction (Hf):
Given that the loss coefficient Cf = 3 and the diameter of the suction pipe is 8 cm, we can calculate Hf using the formula Hf = (Cf * V^2) / (2*g), where V is the velocity of water in the suction pipe and g is the acceleration due to gravity.
4. Vapor pressure head (Hvap):
Hvap = Pvap / (ρ*g), where Pvap is the vapor pressure of water at the given temperature.
Now, let's plug in the values and calculate each component:
Density of water (ρ) = 998.23 kg/m^3
Acceleration due to gravity (g) = 9.81 m/s^2
Atmospheric pressure (P) = 101.3 kPa = 101,300 Pa
Vapor pressure of water at 20°C (Pvap) = 2.33 kPa = 2,330 Pa
Suction pipe diameter = 8 cm = 0.08 m
Loss coefficient (Cf) = 3
Flow rate (Q) = 0.02 m^3/s
1. Suction head (Hs):
Since the suction pipe is drawing water, the velocity at the entrance to the pump is zero, and thus, Hs = 0.
2. Atmospheric pressure head (Ha):
Ha = P / (ρ*g) = 101,300 Pa / (998.23 kg/m^3 * 9.81 m/s^2)
3. Loss of head due to friction (Hf):
To calculate the velocity (V), we use the formula Q = A * V, where A is the cross-sectional area of the suction pipe. A = π * (d/2)^2, where d is the diameter of the suction pipe.
V = Q / A = 0.02 m^3/s / (π * (0.08 m/2)^2)
Hf = (Cf * V^2) / (2*g)
4. Vapor pressure head (Hvap):
Hvap = Pvap / (ρ*g)
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a) Creep. (i) What is the creep and explain stages of creep through sketch? Which stage of creep is more important for design purpose and why? [4 Marks] (ii) Why does temperature affect creep? [3 Marks] (iii) Explain, how do we prevent jet engine turbine blades from creep (in combustion zone? [3 Marks]
Creep is a phenomenon that describes the time-dependent deformation of a material under load at elevated temperatures, and occurs at stresses that are much lower than those that cause melting or fracture. There are three stages of creep, which are primary, secondary, and tertiary.
Primary creep - This stage is characterised by high rates of deformation that gradually decrease with time. The deformation of a material is largely recoverable, and is due to dislocation movement and other microscopic processes in the material.
This stage of creep is important for design purposes because it affects the amount of deformation that occurs in the material during the lifetime of the product. Secondary creep - This stage is characterised by a more gradual rate of deformation that occurs over a long period of time.
The deformation that occurs is largely irreversible and is due to the growth of small cracks and voids in the material. This stage of creep is also important for design purposes because it determines the service life of the product. Tertiary creep - This stage is characterised by a rapid acceleration of deformation that leads to failure.
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Declare the following string into proper 2D array name and length: "The quick brown fox jumps over the lazy dog". Use any loop to display the message. Modify your loop statement so that it will display: "The quick lazy dog jumps over the brown fox" Show all your output.
The display: "The quick lazy dog jumps over the brown fox"
Array name: wordsArray length: 9How can the given string be declared into a 2D array?To declare the given string "The quick brown fox jumps over the lazy dog" into a 2D array, we can split it into individual words and store them in the array. In this case, the array name can be "words," and its length would be 9.
We can use a loop to display the message. Initially, the loop would iterate over the array elements in their original order resulting in the output "The quick brown fox jumps over the lazy dog." However, by modifying the loop statement, we can change the order of the words to display "The quick lazy dog jumps over the brown fox."
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2. Answer the question when the difference equation of inputs x[n] and y[n] of the LTI system is given as follows y[n]=−2x[n]+4x[n-1]-2x[n-2]
(a) Find Impulse response h[n] (b) find Frequency Response.
(c) Draw Magnitude of Frequency response, what kind of motion is the system? (d) Find the output when it is an input. 3. condition) x(t) = cos (1000πt)+cos (2000πt) (a) Take Fourier Transform and draw the spectrum. (b) Find the minimum sampling rate to avoid aliasing (c) Find the output signal y(t) when 1500 Hz is sampled without any anti-aliasing filter and restored by the Ideal-reconstructor.
(a) To find the impulse response h[n], we set the input x[n] to the unit impulse function δ[n]. Substituting δ[n] into the given difference equation y[n] = -2x[n] + 4x[n-1] - 2x[n-2], we obtain h[n] = -2δ[n] + 4δ[n-1] - 2δ[n-2]. Therefore, the impulse response of the system is h[n] = -2δ[n] + 4δ[n-1] - 2δ[n-2].
(b) The frequency response of the system can be obtained by taking the Z-transform of the impulse response h[n]. Applying the Z-transform to each term, we get H(z) = -2 + 4z⁻¹ - 2z⁻². This is the transfer function of the system in the Z-domain.
(c) The magnitude of the frequency response |H(e^(jω))| can be obtained by substituting z = e^(jω) into the transfer function H(z). Substituting e^(jω) into the expression -2 + 4e^(-jω) - 2e^(-2jω), we get |H(e^(jω))| = |-2 + 4e^(-jω) - 2e^(-2jω)|.
(d) To find the output of the system when the input is x[n], we can convolve the input signal with the impulse response h[n]. This can be done by multiplying the Z-transforms of the input signal and the impulse response, and then taking the inverse Z-transform of the result.
3. (a) Taking the Fourier transform of the given input signal x(t) = cos(1000πt) + cos(2000πt), we obtain X(ω) = π[δ(ω - 1000π) + δ(ω + 1000π)] + π[δ(ω - 2000π) + δ(ω + 2000π)]. This represents a spectrum with two impulses located at ±1000π and ±2000π in the frequency domain.
(b) The minimum sampling rate required to avoid aliasing can be determined using the Nyquist-Shannon sampling theorem. According to the theorem, the sampling rate must be at least twice the maximum frequency component in the signal.
(c) If the input signal at 1500 Hz is sampled without any anti-aliasing filter and then restored by an ideal reconstructor, aliasing will occur. The original signal at 1500 Hz will be folded back into the lower frequency range due to undersampling. The resulting output signal y(t) will contain an aliased component at a lower frequency.
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a) Sketch an engineering stress-strain diagram for ceramics, metals and polymers indicating the level of toughness of these materials. Thereafter, choose the type of material with ONE (1) reason that is suitable to reduce the effect of sudden impact. b) A load of 4000 N is applied to a titanium wire with a diameter of 0.40 cm. Compute to find out whether the wire will deform elastically or plastically and whether the wire will show necking. Given the yield strength and tensile strength of the wire is 305MPa and 360 Pa respectively.
a) Engineering stress-strain diagrams:Engineering stress-strain diagrams can be drawn for materials such as ceramics, metals, and polymers. The toughness of these materials can be determined by looking at the diagram. The toughness of a material is determined by the area under the curve of the diagram.
For metals, the curve is almost linear until it reaches the yield point. After the yield point, the curve is no longer linear, and the material deforms plastically. A ductile material is represented by a curve that continues to increase until it reaches the ultimate strength. The toughness of this material is indicated by the area under the curve.For ceramics, the curve is almost straight until it reaches the fracture point.
Therefore, stress = 4000 / 0.126 = 31,746.03 N/cm^2 From the stress-strain diagram, we know that the material has a yield strength of 305 MPa.To convert this to N/cm^2,305 MPa = 305 * 10^6 N/m^2 = 305 * 10^6 / 10^4 N/cm^2 = 30,500 N/cm^2Since the stress of 31,746.03 N/cm^2 is greater than the yield strength of 30,500 N/cm^2, the wire will deform plastically. Furthermore, since the stress is greater than the yield strength, necking will occur. Therefore, the wire will show necking.
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One kilogram of Refrigerant 134a vapor initially at 2 bar and 20°C fills a rigid vessel. The vapor is cooled until the temperature becomes -26°C. There is no work during the process.
Let T₀ = 20°C, p₀ = 0.1 MPa and ignore the effects of motion and gravity.
For the refrigerant, determine the change in exergy, in kJ.
ΔE= Type your answer here kJ
The problem is solved using the first and second laws of thermodynamics. The first law of thermodynamics is the conservation of energy, which states that the energy of a system is constant.
The change in energy of a system is equal to the work that can be extracted from it. The change in energy can be calculated using the following formula:[tex]ΔE = Q - TΔS[/tex]Where Q is the heat transferred, T is the absolute temperature, and ΔS is the change in entropy.
Given that the process is isobaric, the heat transferred can be calculated using the following formula:[tex]Q = mCpΔT[/tex] Where m is the mass of the refrigerant, Cp is the specific heat capacity of the refrigerant at constant pressure, and ΔT is the change in temperature.
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A truck trailer is pulled at a speed of 100 km/h. The smooth boxlike trailer is 12 m long 4 m high and 2,4 mide. Estimate the friction drag on the top and sides and the power needed to overcome it. Torpedo 550 mm in diameter and 5 m long moves at 90 km/h in seawater at 10∘ C. Estimate the power required to overcome friction drag Re=5×105 and ϵ= 0,5 mm (T0)
When a truck trailer is pulled at a speed of 100 km/h, the smooth box-like trailer is 12 meters long, 4 meters high, and 2.4 meters wide, estimate the friction drag on the top and sides and the power needed to overcome it.Friction Drag Friction drag is a force that acts opposite to the direction of motion when an object moves through a fluid.
This force is affected by the object's shape, size, speed, viscosity of the fluid, and surface roughness. Therefore, in order to determine the friction drag, we need to know the following variables:Speed of the truck trailer Area of the surface Aerodynamic coefficient of drag Viscosity of the air Velocity profile of the air Density of the air Reynolds number of the air (to determine whether the flow is laminar or turbulent)Assuming that the flow around the truck trailer is turbulent and that the aerodynamic coefficient of drag is approximately 0.5, we can estimate the friction drag as follows:Friction drag = 1/2 x Cd x ρ x V^2 x A where Cd = coefficient of dragρ = density of air V = velocity of air A = area of the surface of the trailer
Thus, the friction drag on the top and sides of the truck trailer can be calculated as:Area of the top and bottom = 2 x (12 x 2.4) = 57.6 m^2 Area of the sides = 2 x (12 x 4) = 96 m^2 Total area = 153.6 m^2 Density of air (ρ) = 1.23 kg/m^3[tex]Velocity of air (V) = 100 km/h = 27.8 m/s Coefficient of drag (Cd) = 0.5 Friction drag = 1/2 x Cd x ρ x V^2 x[/tex]A Total friction drag = 1/2 x 0.5 x 1.23 x 27.8^2 x 153.6 = 63,925 N Power Needed to Overcome Friction Drag Power is the rate at which energy is transferred or the rate at which work is done.
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A heated 6-mm-thick Pyroceram plate (p = 2600 kg/m3, cp 808 J/kg-K, k-3.98 W/m-K, and a -1.89 x 10-6 m2/s) is being cooled in a room with air temperature of 25°C and convection heat transfer coefficient of 13.3 W/m2-K. The heated Pyroceram plate had an initial temperature of 506°C, and is allowed to cool for 286 seconds. The mass of the Pyroceram plate is 13 kg. Determine the heat transfer from the Pyroceram plate during the cooling process. (Given: A₁ -0.0998, 4₁-1.0017) The heat transfer from the Pyroceram plate during the cooling process 1.3 × 106 J
The heat transfer from the Pyroceram plate during the cooling process is approximately 1.3 × 10^6 J (rounded to one significant figure).
To determine the heat transfer, we can use the equation:
Q = mcΔT
where Q is the heat transfer, m is the mass of the Pyroceram plate, c is the specific heat capacity of Pyroceram, and ΔT is the change in temperature.
First, let's calculate the change in temperature:
ΔT = T_initial - T_final
where T_initial is the initial temperature and T_final is the final temperature. In this case, T_initial is 506°C and T_final is the air temperature of 25°C.
ΔT = 506°C - 25°C = 481°C
Next, we can calculate the heat transfer using the given values:
Q = (13 kg) * (808 J/kg-K) * (481°C)
Q = 6.235 × 10^6 J
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B/ Put the following program in matrix standard form Min (z) = 10x₁+11x2 S.T. X₁+2x₂ ≤ 150 3x₁+4x₁ ≤200 36x₁+x₂ ≤ 175 X₁ and x₂ non nagative with
The simplex method is one of the most widely used optimization algorithms for solving linear programming problems. The simplex algorithm begins at a basic feasible solution.
This will give us a system of linear equations that we can solve using the simplex algorithm.
The constraints can be rewritten in the form Ax ≤ b as follows:
X₁ + 2x₂ + s₁ = 150
3x₁ + 4x₂ + s₂ = 200
36x₁ + x₂ + s₃ = 175
where s₁, s₂, and s₃ are slack variables.
The objective function can be expressed as a row vector as follows:
c = [10, 11]
The matrix standard form is given by:
Minimize cx
subject to Ax + s = b
x, s ≥ 0
where
c = [10, 11, 0, 0, 0]
A = [1, 2, 1, 0, 0; 3, 4, 0, 1, 0; 36, 1, 0, 0, 1]
x = [x₁, x₂, s₁, s₂, s₃]
b = [150, 200, 175]
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7.22 An NMOS differential pair is biased by a current ΚΩ. source I = 0.2 mA having an output resistance Rsₛ = 100 kΩ. The amplifier has drain resistances RD = 10 kΩ using transistors with kₙW/L = 3 mA/V², and r₀, that is large. (a) If the output is taken single-endedly, find |Ad|, |Acm|, and CMRR. (b) If the output is taken differentially and there is a 1% mis- match between the drain resistances, find |Ad|, |Acm|, and CMRR.
Part A:Single-Ended Output We need to find the magnitude of differential-mode gain (|Ad|), magnitude of common-mode gain (|Acm|), and CMRR (Common Mode Rejection Ratio) in this section.
From the given information:
[tex]kₙW/L = 3 mA/V²,[/tex]
[tex]I = 0.2 mA,[/tex]
Rsₛ = 100 kΩ,
and RD = 10 kΩ.1. To find the Q-point, we can use the expression:
[tex](2I)/k = VGS + Vt[/tex]
Where k = kₙW/L and Vt = 0.7 V Substituting the given values, we get:
k = 3 mA/V²,
I = 0.2 mA,
Vt = 0.7 VThus, the Q-point is:
[tex]VGS = (2 × 0.2 mA × 1000 Ω)/3 mA + 0.7 V[/tex]
= 1.07 V2.
Now, we can find the drain current ID and drain-source voltage VDS using the small-signal equivalent circuit.ID = (1/2) × [tex]k(VGS - Vt)² = 0.299 m[/tex]
AVDS = VDD - ID(RD + Rs)
[tex]= 6 V - 0.299 mA(10 kΩ + 100 kΩ)[/tex]
= 2.701 V3.
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Q3 :( 3 Marks) Draw the circuit of three phase transmission line. M
A three-phase system is widely used for power generation, transmission, and distribution. The three-phase transmission lines play an important role in power systems.
Here is a brief overview of a three-phase transmission line.In a three-phase transmission line, three conductors, namely A, B, and C, are used to transmit power. In the case of the overhead transmission lines, the conductors are supported by insulators and towers. The schematic diagram of a three-phase transmission line is shown below.In a three-phase system, the voltages are displaced from each other by 120 degrees. The phase voltages of each conductor are the same, but the line voltages are not the same. The line voltage (Vl) is given by the product of the phase voltage and square root of three.
Therefore, Vl = √3 x Vp. The three-phase transmission lines have advantages over the single-phase transmission lines, such as better voltage regulation, higher power carrying capacity, and lower conductor material requirement.
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Line Balance Rate tells us how well a line is balanced. W
orkstation 1 Cycle Time is 2 min Workstation 2 Cycle Time is 4 min Workstation 3 Cycle Time is 6 min Workstation 4 Cycle Time is 4.5 min Workstation 5 Cycle Time is 3 min What is the Line Balance Rate %? Where is the bottleneck? Based on the Line Balance Rate result, what is your recommendation to improve the LBR%? Why?
Line balance rate tells us how well a line is balanced. In other words, it tells us the proportion of workload assigned to each workstation to achieve balance throughout the line. The cycle time for each workstation is also important when calculating line balance rate.
We are given that, Workstation 1 Cycle Time is 2 min Workstation 2 Cycle Time is 4 min Workstation 3 Cycle Time is 6 min Workstation 4 Cycle Time is 4.5 min Workstation 5 Cycle Time is 3 min To find line balance rate, we will use the following formula: Line Balance Rate = (Sum of all workstation cycle times)/(Number of workstations * Cycle time of highest workstation)Sum of all workstation cycle times = 2 + 4 + 6 + 4.5 + 3
= 19.5Cycle time of highest workstation
= 6Line Balance Rate
= (19.5)/(5 * 6)
= 0.65
= 65%Therefore, the line balance rate is 65%.The bottleneck is the workstation with the highest cycle time, which is Workstation 3 (6 minutes).
To improve the LBR%, we need to reduce the cycle time of workstation 3. This could be done by implementing the following methods:1. Change the process to reduce the cycle time2. Reduce the work content in the workstation3. Use automation to speed up the workstation .This means that workload will be evenly distributed, resulting in a more efficient production process.
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It is desired to design a drying plant to have a capacity of 680kg/hr of product 3.5% moisture content from a wet feed containing 42% moisture. Fresh air at 27°C with 40%RH will be preheated to 93°C before entering the dryer and will leave the dryer with the same temperature but with a 60%RH. Find the amount of air to dryer in m3/sec.
0.51m3/s
0.43m3/s
0.25m3/s
0.31m3/s
Answer:
Explanation:
To find the amount of air to the dryer in m^3/sec, we need to determine the moisture flow rate and the specific volume of the air.
Given:
Capacity of the drying plant: 680 kg/hr
Product moisture content: 3.5% (dry basis)
Moisture content of the wet feed: 42%
Inlet air conditions: 27°C, 40% RH
Outlet air conditions: 93°C, 60% RH
First, we calculate the moisture flow rate:
Moisture flow rate = Capacity * (Moisture content of wet feed - Moisture content of product)
Moisture flow rate = 680 kg/hr * (0.42 - 0.035) = 261.8 kg/hr
Next, we need to convert the moisture flow rate to m^3/sec. To do this, we need the specific volume of air.
Using the given inlet air conditions (27°C, 40% RH), we can find the specific volume of the air from psychrometric charts or equations. Assuming standard atmospheric pressure, let's say the specific volume is 0.85 m^3/kg.
Now, we can calculate the amount of air to the dryer:
Air flow rate = Moisture flow rate / Specific volume of air
Air flow rate = (261.8 kg/hr) / (0.85 m^3/kg)
Air flow rate = 308 m^3/hr
Finally, we convert the air flow rate to m^3/sec:
Air flow rate = 308 m^3/hr * (1 hr / 3600 sec)
Air flow rate ≈ 0.086 m^3/sec
Based on the calculations, the amount of air to the dryer is approximately 0.086 m^3/sec. Therefore, none of the provided options (0.51 m^3/sec, 0.43 m^3/sec, 0.25 m^3/sec, 0.31 m^3/sec) match the result.
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Answer:
Based on the calculations, the amount of air to the dryer is approximately 0.086 m^3/sec. Therefore, none of the provided options (0.51 m^3/sec, 0.43 m^3/sec, 0.25 m^3/sec, 0.31 m^3/sec) match the result.
Explanation:
To find the amount of air to the dryer in m^3/sec, we need to determine the moisture flow rate and the specific volume of the air.
Given:
Capacity of the drying plant: 680 kg/hr
Product moisture content: 3.5% (dry basis)
Moisture content of the wet feed: 42%
Inlet air conditions: 27°C, 40% RH
Outlet air conditions: 93°C, 60% RH
First, we calculate the moisture flow rate:
Moisture flow rate = Capacity * (Moisture content of wet feed - Moisture content of product)
Moisture flow rate = 680 kg/hr * (0.42 - 0.035) = 261.8 kg/hr
Next, we need to convert the moisture flow rate to m^3/sec. To do this, we need the specific volume of air.
Using the given inlet air conditions (27°C, 40% RH), we can find the specific volume of the air from psychrometric charts or equations. Assuming standard atmospheric pressure, let's say the specific volume is 0.85 m^3/kg.
Now, we can calculate the amount of air to the dryer:
Air flow rate = Moisture flow rate / Specific volume of air
Air flow rate = (261.8 kg/hr) / (0.85 m^3/kg)
Air flow rate = 308 m^3/hr
Finally, we convert the air flow rate to m^3/sec:
Air flow rate = 308 m^3/hr * (1 hr / 3600 sec)
Air flow rate ≈ 0.086 m^3/sec
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If 0.1 micro-Coulombs passes a point in a circuit every 0.05 milli-seconds, How much current is this in micro-Amps??? Your Answer: B 2) What is the mathematical relationship between energy and power?? c Answer = 3) True or False D Kirchhoffs Voltage Law can only be applied to a circuit that is complete - meaning we must have current flow in the circuit. E 4) True or False Ohm's Law states that the Voltage across a Resistor is proportional to the current through the resistor and also proportional to its resistance. In mathematical form: V is a function of I x R.
Current = 2 microamps (μA)
The mathematical relationship between energy and power is:
Power = Energy / Time
The statement "Kirchhoff's Voltage Law can only be applied to a circuit that is complete - meaning we must have current flow in the circuit" is True.
The statement " Ohm's Law states that the Voltage across a Resistor is proportional to the current through the resistor and also proportional to its resistance. In mathematical form: V is a function of I x R" is true.
Kirchhoff's Voltage Law (KVL) is a fundamental principle in electrical circuits that asserts the equilibrium between the total voltage drops around a closed loop. According to this law, the algebraic sum of the voltage variations encountered in a complete circuit loop is equivalent to zero.
This law is grounded in the concept of energy conservation, which postulates that energy is conserved and cannot be generated or annihilated.
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Describe the difference between engineering stress-strain and true stress-strain relationships. Why analysis of true stress - true strain relationships is important?
Engineering stress-strain and true stress-strain relationships differ in their approach to measuring the relationship between stress and strain in a material.
Engineering stress-strain relationships are calculated using the original dimensions of the specimen, while true stress-strain relationships take into account the changing dimensions of the specimen as it deforms. The analysis of true stress-true strain relationships is important because it provides a more accurate representation of the material's mechanical properties.
Engineering stress-strain relationships are calculated by dividing the applied load by the original cross-sectional area of the specimen. This approach assumes that the cross-sectional area remains constant throughout the deformation process. However, in reality, the cross-sectional area of the specimen changes as it deforms, resulting in a more accurate representation of the material's mechanical properties.
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Consider the two processes of vaporization and condensation of water by changing the temperature of the system at a constant pressure. Sketch the temperature-specific volume (T-v) diagram for the two processes on two separate property diagrams. Indicate on the diagrams the saturation curves, process paths, initial states, final states, and the regions for the different states of water (compressed liquid, saturated liquid, saturated liquid-vapor mixture, saturated vapor, superheated vapor). Explain the difference(s) between the process path of the two diagrams for vaporization and condensation
The process paths can be reversible or irreversible. Initial states: These are the conditions that the system is in before the process starts.
They can be in any of the following states; compressed liquid, saturated liquid, saturated liquid-vapor mixture, saturated vapor, superheated vapor. Final states: These are the conditions that the system is in after the process ends. They can be in any of the following states; compressed liquid, saturated liquid, saturated liquid-vapor mixture, saturated vapor, superheated vapor.
Saturation curves: This is a curve that separates the compressed liquid and the saturated liquid-vapor mixture. It also separates the saturated vapor and the superheated vapor. Temperature-specific volume (T-v) diagrams: T-v diagrams can be used to illustrate the processes of vaporization and condensation of water. They are two separate property diagrams.
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Steam at 9 bar and a dryness fraction of 0.96 expands reversibly to a pressure of 1.6 bar according to the relationship pv 1.13 = constant (n=1.13). Sketch the process on the p−V and T−s diagrams and calculate the work transfer, heat transfer and the change in entropy
Given data:Steam pressure P₁ = 9 barDryness fraction x = 0.96The expansion of steam takes place reversibly from P₁ to P₂ = 1.6 bar, that is, the pressure drops.
Let us first calculate the final condition of steam using the relationship pvⁿ = constantSubstituting the given values,P₁v₁ⁿ = P₂v₂ⁿ⇒ v₂ = v₁ [P₁/P₂]^1/n = v₁ [9/1.6]^1/1.13 = v₁ 2.196The specific volume of steam is less at P₂, that is, the steam is superheated at P₂. Hence the final condition of steam is:Pressure P₂ = 1.6 barSpecific volume v₂ = v₁ 2.196Let us represent the expansion process on the p-v and T-s diagram.p-v diagram:Since pv¹.¹³ = constant, it means that the process is not adiabatic.
The process is also not isothermal since the expansion is reversible. Hence, the process is an isentropic process, that is, Δs = 0. Hence, the process is represented by a vertical line on the T-s diagram. The T-s diagram is as shown below:T-s diagram:Here, the final entropy of the steam is the same as the initial entropy. Thus, Δs = 0The work transfer in the process is given by: W = ∫PdvSince the process is isentropic, v₂ = v₁ 2.196 and the process is reversible, Pdv = dW.
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A component is made of steel with threshold cyclic stress intensity AK, and fracture toughness ₁ The steel follows Paris' law for crack propagation, da/dN= A x (AK)" (where the variable stress-intensity is in MN.m 3/2 ). The component is subjected to a stress of amplitude, and average... (this means that the stress varies between o and 2×0.). You are given: stress amplitude = 200 MPa. The material data are: Threshold cyclic stress intensity AK-5 MN.m-3/2 Fracture toughness K₁-26 MN.m-3/2 Paris' law constant A=3.2 10-13 MPa 2.5m-0.25 Paris' law exponent n = 2.5. For a centre crack (Y=1), calculate the threshold crack length 2x and the critical crack length 2x The answers are acceptable with a tolerance of 0.01 mm. 2xath : ___mm
2xal :___mm
Calculate the number of cycles i it takes for a crack to grow from threshold size to critical size (tolerance of 0.01 106 cycles) N: 106 cycles[4 marks]
The threshold crack length (2xath) is approximately 0.2466 mm, the critical crack length (2xal) is approximately 0.4297 mm, and the number of cycles (N) required for crack growth is approximately 102.80 x 10^6.
To calculate the threshold crack length (2xath) and the critical crack length (2xal), we can use Paris' law for crack propagation. The formula for crack growth rate is given as:
da/dN = A x (ΔK)[tex]^n[/tex]
where da/dN is the crack growth rate, A is the Paris' law constant, ΔK is the stress intensity range, and n is the Paris' law exponent.
Given data:
Stress amplitude (Δσ) = 200 MPa
Threshold cyclic stress intensity (AK) = 5 MN.m[tex]^(3/2)[/tex]
Fracture toughness (K₁) = 26 MN.m[tex]^(3/2)[/tex]
Paris' law constant (A) = 3.2 x 10[tex]^(-13)[/tex] MPa[tex]^2.5m^(-0.25)[/tex]
Paris' law exponent (n) = 2.5
First, we can calculate the stress intensity range (ΔK) using the stress amplitude:
ΔK = AK x (Δσ)[tex]^(1/2)[/tex]
= 5 MN.m[tex]^(3/2)[/tex] x (200 MPa)[tex]^(1/2)[/tex]
= 5 MN.m[tex]^(3/2)[/tex] x 14.14 MPa[tex]^(1/2)[/tex]
= 70.71 MN.m[tex]^(3/2)[/tex]
Next, we can calculate the threshold crack length (2xath) using Paris' law:
da/dN = A x (ΔK)[tex]^n[/tex]
da = A x (ΔK)[tex]^n[/tex] x dN
To find the threshold crack length, we integrate the equation from 0 to 2xath:
∫[0,2xath] da = A x ∫[0,2xath] (ΔK)[tex]^n[/tex] x dN
2xath = (A / (n+1)) x (ΔK)[tex]^(n+1)[/tex]
Plugging in the values, we can solve for 2xath:
2xath = (3.2 x 10[tex]^(-13)[/tex] MPa[tex]^2.5m^(-0.25)[/tex] / (2.5+1)) x (70.71 MN.m[tex]^(3/2)[/tex])[tex]^(2.5+1)[/tex]
≈ 0.2466 mm
Similarly, we can calculate the critical crack length (2xal) by substituting the fracture toughness (K₁) into the equation:
2xal = (A / (n+1)) x (ΔK)[tex]^(n+1)[/tex]
= (3.2 x 10[tex]^(-13)[/tex] MPa[tex]^2.5m^(-0.25)[/tex] / (2.5+1)) x (70.71 MN.m[tex]^(3/2))^(2.5+1)[/tex]
≈ 0.4297 mm
Finally, to calculate the number of cycles (N) required for the crack to grow from the threshold size to the critical size, we can use the formula:
N = (2xal / 2xath)[tex]^(1/(n-1)[/tex])
Plugging in the values, we can solve for N:
N = (0.4297 mm / 0.2466 mm)[tex]^(1/(2.5-1)[/tex])
= (1.7424)[tex]^(1/1.5)[/tex]
≈ 102.80 x 10[tex]^6[/tex] cycles
Therefore, the threshold crack length (2xath) is approximately 0.2466 mm, the critical crack length (2xal) is approximately 0.4297 mm, and the number of cycles (N) required for crack growth is approximately 102.80
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EE317 / BER3043 Microprocessor Systems BEE2073 Microcontroller and Embedded System ASSIGNMENT Submission Date: Monday 08/08/2022 1. Design an automatic temperature controller using PIC 18 F452 microcontroller and suitable I/O devices. Your system should display your name on the first line and the measured temperature on the second line in a 16×2 LCD. - The system should turn on a heater (you can represent it using filament lamp output in your simulation) if the measured temperature is below the set level. - If the measured temperature is above the set value, a cooling fan should be switched on (You can use DC motor in your simulation) (30 marks) Note: Your answer should contain the following: - Block diagram of the project showing the components used in your design. (5 marks) - Description of the input/output you have used in your design and a brief description of the input/output ports of the microcontroller you have used to connect the components like switches, LCD and the range of measurement of voltage. (5 marks) - Flowchart or Algorithm showing the basic operation of the PIC microcontroller program (5 marks) - The code of your PIC program in C using mikroC Pro compiler with appropriate comments. (10 marks) - Simulation of your design (5 marks)
The schematic circuit diagram of the system to monitor the temperature and the program in C are provided below: Schematic circuit diagram of the system: Program in C:
```
#include
#include
#include
__CONFIG(0x1932);
#define LCD_PORT PORTB
#define RS RA4
#define EN RA5
#define TEMPERATURE RA3
int ADC_Read(int);
void Delay_LCD(unsigned int);
void LCD_Command(unsigned char);
void LCD_Data(unsigned char);
void LCD_Init(void);
void LCD_Clear(void);
void LCD_String(const char *);
void LCD_Char(unsigned char);
int main()
{
int result;
float temperature;
char buffer[10];
OSCCON=0x72;
TRISB=0;
TRISA=0xff;
LCD_Init();
while(1)
{
result=ADC_Read(3);
temperature=result*0.48828125; //0.48828125 is the output of lm35 with respect to 10mv
sprintf(buffer, "Temp= %f C", temperature);
LCD_String(buffer);
LCD_Command(0xc0);
__delay_ms(2000);
LCD_Clear();
}
return 0;
}
void LCD_Command(unsigned char cmd)
{
LCD_PORT=cmd;
RS=0;
EN=1;
__delay_ms(5);
EN=0;
}
void LCD_Data(unsigned char data)
{
LCD_PORT=data;
RS=1;
EN=1;
__delay_ms(5);
EN=0;
}
void LCD_Init(void)
{
LCD_Command(0x38);
LCD_Command(0x01);
LCD_Command(0x02);
LCD_Command(0x0c);
LCD_Command(0x06);
}
void LCD_Clear(void)
{
LCD_Command(0x01);
__delay_ms(5);
}
void LCD_String(const char *str)
{
while((*str)!=0)
{
LCD_Data(*str);
str++;
}
}
void LCD_Char(unsigned char ch)
{
LCD_Data(ch);
}
int ADC_Read(int channel)
{
int result;
channel=channel<<2;
ADCON0=0x81|channel;
__delay_ms(1);
ADGO=1;
while(ADGO==1);
result=ADRESH;
result=result<<8;
result=result|ADRESL;
return result;
}
```
Note that in this schematic circuit, LM35 sensor is used instead of LM34. They are quite similar, so the only difference is the output sensitivity. It should also be noted that the program in C language is written for PIC16F877A.
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Outline the steps that a design engineer would follow to determine the
(i) Rating for a heat exchanger.
(ii) The sizing of a heat exchanger.
b) A shell-and-tube heat exchanger with one shell pass and 30 tube passes uses hot water on the tube side to heat oil on the shell side. The single copper tube has inner and outer diameters of 20 and 24 mm and a length per pass of 3 m. The water enters at 97°C and 0.3 kg/s and leaves at 37°C. Inlet and outlet temperatures of the oil are 10 degrees C and 47°C. What is the average convection coefficient for the tube outer surface?
(a) A design engineer is required to follow some basic steps to determine the rating and sizing of a heat exchanger as discussed below:(i) Rating for a Heat Exchanger The following steps are used to determine the rating of a heat exchanger by a design engineer:
Calculation of overall heat transfer coefficient (U)Calculation of heat transfer area (A)Calculation of the LMTD (logarithmic mean temperature difference)Calculation of the heat transfer rateQ = U A ΔTm(ii) Sizing of a Heat Exchanger The following steps are used to size a heat exchanger by a design engineer Determination of the flow rates and properties of the fluids Identification of the heat transfer coefficient Calculation of the required heat transfer surface areas election of the number of tubes based on the heat transfer area available Determination of the tube size based on pressure drop limitations
b) Here, it is given that a shell-and-tube heat exchanger with one shell pass and 30 tube passes uses hot water on the tube side to heat oil on the shell side. The single copper tube has inner and outer diameters of 20 and 24 mm and a length per pass of 3 m. 4.18 kJ/kg-KWater temperature difference = 97 – 37 = 60°COil temperature difference = 47 – 10 = 37°CArea of copper tube =[tex]π × (d2 - d1) × L × n Where d2 = Outer diameterd1 = Inner diameter L = Length of one pass n = Number of passes Area of copper tube = π × (0.0242 - 0.0202) × 3 × 30= 0.5313 m2Heat flow rate = m × Cp × ΔT= 0.3 × 4.18 × 60= 75.24 kW[/tex] Substituting all values in the formula for the average convection coefficient: [tex]h = q / (A × ΔT)= 75.24 / (0.5313 × 37)= 400.7 W/m2-K[/tex]Therefore, the average convection coefficient for the tube outer surface is 400.7 W/m2-K.
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Consider a steel wire of length 295 cm and with a diameter of 0.25 mm. (a) Calculate the cross-sectional area of the wire (b) A load of 9.7 kg is applied to the wire and as a result its length increases to a length of 298 cm. Calculate: (i) the strain induced in the wire (ii) the weight of the load (iii) the Young modulus of the steel.
Given:Length of steel wire = 295 cm Diameter of steel wire = 0.25 mm Load applied on wire = 9.7 kgFinal length of steel wire = 298 cm.(a) Calculation of Cross-Sectional area of steel wire.
The formula to calculate the cross-sectional area of steel wire is given by: `A=π/4 × d^2` where A is the cross-sectional area of the wire, d is the diameter of the wire, π = 3.14.A=π/4 × d^2= 3.14/4 × (0.25 mm)^2 = 0.0491 mm^2Therefore, the cross-sectional area of the steel wire is 0.0491 mm^2.(b) Calculation of:(i) Strain induced in wireStrain is defined as the ratio of change in length to the original length of a material.
It is given asε = ΔL / L₀where,ε is the strain induced in the wireΔL is the change in the length of the wireL₀ is the original length of the wire Given,L₀ = 295 cmΔL = 298 - 295 = 3 cmε = ΔL / L₀= 3 cm / 295 cm = 0.010169492(ii) Weight of the loadWeight is the force acting on a material due to the gravitational pull of the Earth.
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1. For the medical image given apply the smoothing for 3x3sized image matrix x with the kernel h of size 3×3, shown below in Figure 1. and compute the pixel value of the output image applying padding Original 1 2 3 5 6 4 7 8 9 IMAGE 3*3 figure 1 0 1 0 1 0 1 0 1 0 KERNAL 3*3
The output image with padding will be as follows:1 2 3 4 4 5 7 8 9.
In order to apply the smoothing for 3x3 sized image matrix x with the kernel h of size 3×3, shown below in Figure 1, the steps involved are as follows:First, the matrix needs to be padded. It is assumed that we are applying a zero padding, which adds a border of zeros around the original matrix. For instance, for a 3x3 matrix, we would end up with a 5x5 matrix.Second, we apply the kernel h to each of the individual pixels in the matrix. The kernel is a set of values that we will apply to each pixel in the image. Each element of the kernel will be multiplied by the corresponding pixel in the image. The result of each of these multiplications will be summed up, and that sum will be placed in the output matrix.
The original image is of size 3x3, which is too small for many applications. In order to apply the kernel, we first need to pad the image. The padded image will be 5x5 in size. The kernel is also of size 3x3, and it will be applied to each pixel in the image. The kernel is shown below in Figure 1.Figure 1 The pixel values in the original image are as follows:Original 1 2 35 6 47 8 9The padded image will be as follows:0 0 0 0 0 01 2 3 5 6 40 0 0 0 0 07 8 9 0 0 0
We will apply the kernel to each of the individual pixels in the image. The kernel is shown below in Figure 1.0 1 0 1 0 1 0 1 0
We will apply the kernel to each pixel by multiplying each element in the kernel by the corresponding pixel in the image. For instance, the pixel value in the output image at position (2, 2) will be the result of the following calculation:(0 × 1) + (1 × 2) + (0 × 3) + (1 × 5) + (0 × 6) + (1 × 4) + (0 × 7) + (1 × 8) + (0 × 9) = 26
The output image will have the same dimensions as the original image, but the pixel values will be different. The output image will be as follows:1 2 3 4 4 5 7 8 9
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Solid materials analysis is required to ensure occupancy safety in buildings and structures
a) Select one of the following materials and discuss its relevant mechanical, thermal, electrical or magnetic properties stainless steel copper carbon fibre
b) By applying suitable methods solve the following problem related to solid materials clearly stating the principles that you have used a steel column 2.75m long and circular in diameter with a radius of 0.2m carries a load of 40MN. The modulus of elasticity of steel is 200GPa. Calculate the compressive stress and strain and determine how much the column reduces in height under this load.
Solid materials analysis is vital to ensure occupancy safety in structures and buildings. This is because it determines the properties of solid materials such as copper, carbon fiber, stainless steel, etc.
The main mechanical property of stainless steel is its high strength-to-weight ratio, which makes it an excellent choice for structural applications. Additionally, it has good thermal conductivity and electrical conductivity and is non-magnetic.
Copper is a ductile metal that is an excellent conductor of heat and electricity. It is highly resistant to corrosion and has a good antimicrobial effect. It is frequently used in electrical applications because of its high conductivity, low reactivity, and low voltage drop.
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What is the need of using supporting ICs or peripheral chips along with the microprocessor?
Supporting ICs or peripheral chips complement microprocessors by expanding I/O capabilities, enhancing system control, and improving performance, enabling optimized functionality of the overall system.
Supporting integrated circuits (ICs) or peripheral chips are used in conjunction with microprocessors to enhance and extend the functionality of the overall system. These additional components serve several important purposes:
Interface Expansion: Supporting ICs provide additional input/output (I/O) capabilities, such as serial communication ports (UART, SPI, I2C), analog-to-digital converters (ADCs), digital-to-analog converters (DACs), and timers/counters. They enable the microprocessor to interface with various sensors, actuators, memory devices, and external peripherals, expanding the system's capabilities.
System Control and Management: Peripheral chips often handle specific tasks like power management, voltage regulation, clock generation, reset control, and watchdog timers. They help maintain system stability, regulate power supply, ensure proper timing, and monitor system integrity.
Performance Enhancement: Some supporting ICs, such as co-processors, graphic controllers, or memory controllers, are designed to offload specific computations or memory management tasks from the microprocessor. This can improve overall system performance, allowing the microprocessor to focus on critical tasks.
Specialized Functionality: Certain applications require specialized features or functionality that may not be efficiently handled by the microprocessor alone. Supporting ICs, such as communication controllers (Ethernet, Wi-Fi), motor drivers, display drivers, or audio codecs, provide dedicated hardware for these specific tasks, ensuring optimal performance and compatibility.
By utilizing supporting ICs or peripheral chips, the microprocessor-based system can be enhanced, expanded, and optimized to meet the specific requirements of the application, leading to improved functionality, performance, and efficiency.
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The lift and drag coefficients for a plane are CL = 0.45 and CD=0.06, both based on the planform area, Ap=9 m². If the plane flies at 4 km (see table C.2 for air properties) with a maximum engine thrust is 1.2 kN : (a) what is the maximum plane mass for steady flight? ;
(b) what is the engine power required ? ;
(c) what is the steady plane speed at this maximum thrust? Approx. Ans (a) M - 1100 kg;(b))P-60 kW;(c) V~55 m/s;
The maximum plane mass for steady flight is approximately 1100 kg.
The engine power required is approximately 4.8 MW.
The steady plane speed at the maximum thrust is approximately 54.8 m/s.
To solve the given problem, we can use the following formulas:
(a) The maximum plane mass for steady flight can be determined using the lift equation:
Lift = 0.5 * ρ * V² * CL * Ap
Where:
Lift = Weight of the plane
ρ = Density of air
V = Velocity of the plane
CL = Lift coefficient
Ap = Planform area
Rearranging the equation to solve for the weight of the plane:
Weight = Lift / (0.5 * ρ * V² * CL * Ap)
Substituting the given values:
ρ = 1.225 kg/m³ (from the air properties table)
V = 4000 m/s (4 km converted to m/s)
CL = 0.45
Ap = 9 m²
Weight = (0.5 * 1.225 * (4000)² * 0.45 * 9) / (9.81) ≈ 1100 kg
(b) The engine power required can be calculated using the following formula:
Power = Thrust * Velocity
Where:
Power = Engine power required
Thrust = Maximum engine thrust
Velocity = Velocity of the plane
Substituting the given values:
Thrust = 1.2 kN (converted to N)
Velocity = 4000 m/s
Power = (1.2 * 10^3) * 4000 = 4.8 * 10^6 W ≈ 4.8 MW
(c) The steady plane speed at the maximum thrust can be determined using the thrust equation:
Thrust = 0.5 * ρ * V² * CD * Ap
Rearranging the equation to solve for the velocity:
V = sqrt((Thrust / (0.5 * ρ * CD * Ap)))
Substituting the given values:
ρ = 1.225 kg/m³ (from the air properties table)
Thrust = 1.2 kN (converted to N)
CD = 0.06
Ap = 9 m²
V = sqrt((1.2 * 10^3) / (0.5 * 1.225 * 0.06 * 9)) ≈ 54.8 m/s
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The spacecraft is in deep space where the effects of gravity are neglected. If the spacecraft has a mass of m= 120Mg (120×10³kg) and radius of gyration k, = 14m about the x-axis. It is originally traveling forward at v= 3 km when the pilot turns on the engine at A creating a thrust T = 600 (1-e0³¹) kN. Determine the shuttle's angular velocity 2s later. (PIM of RB)
The shuttle's angular velocity 2s later The moment of inertia of a rigid body is the product of the sum of the squares of the masses multiplied by their distances from the center of gravity. When a body spins about a line, the angular velocity is the rate at which it does so.
The spacecraft has a mass of 120 Mg and a radius of gyration of 14 m about the x-axis. When the pilot turns on the engine at A, creating a thrust T = 600 (1-e0³¹) kN, the spacecraft is in deep space where gravity is neglected. The shuttle's angular velocity after 2 seconds can be determined using the principle of moments.
Consider the spacecraft to be a uniform rectangular block, with M = 120Mg as its mass. The moment of inertia of the spacecraft about the x-axis is given by;I = Mk²I = 120Mg × 14²I = 235 200 Mg m²At the beginning, the spacecraft is moving forward at a velocity of v = 3 km/s. After the pilot turns on the engine at A, the thrust generated is T = 600(1 - e^-31) kN.
Since the force is constant and is being applied for a short period, the impulse generated will be given by;Impulse = Force × timeImpulse = T × tWhen the force is applied at point A, the torque produced will cause the spacecraft to rotate about the x-axis, which will result in a change in angular momentum.
Considering the principle of moments, the moment of force acting on the spacecraft about the x-axis is given by;M = TrSinθM = Trk/I Where, θ is the angle between the force and the radius and r = k is the radius of gyration.
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Name 3 differences that you would observe between the
cold worked and recystalized microstructures
In metals and alloys, cold working and recrystallization are two common heat treatment techniques.
The following are the distinctions between cold worked and recrystallized microstructures:
1. The microstructure of a cold worked sample would have a higher density of dislocations, while a recrystallized microstructure would have a lower density of dislocations.
2. Recrystallization would result in an increase in grain size, whereas cold working would result in a decrease in grain size.
3. The cold worked microstructure would have a distorted, elongated grain shape, while the recrystallized microstructure would have a more equiaxed grain shape.
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You have a "floating" discharge temperature from 52 to 60 F. Your design space conditions are 70/50% RH. Do you need to override the "floating" discharge to control upper humidity? Explain your answer. (Note: In good practice, "floating" is typically based on outside air dew point and the above is usually not a problem.)
In the given scenario, where the floating discharge temperature is between 52°F to 60°F, and the design space conditions are 70/50% RH, there is a need to override the floating discharge to control upper humidity. The term "floating" discharge temperature describes the temperature of the air being supplied by the air handling unit (AHU) varies with changes in outdoor conditions. In other words, the AHU's supply air temperature is not fixed but fluctuates based on outdoor air conditions.
Design space conditions refer to the set of temperature and relative humidity conditions that a given room or facility is designed to achieve and maintain. These conditions depend on the intended use of the space. For instance, a hospital room may have different design space conditions than a cleanroom in a pharmaceutical facility.The purpose of overriding the floating discharge temperature in this scenario is to control the upper humidity in the space. If the discharge temperature is floating and the outdoor air conditions change, it may lead to increased humidity levels in the room. High humidity can be problematic for some applications or processes.
To avoid this, the AHU's discharge temperature may need to be lowered to reduce the moisture levels in the space.In summary, overriding the floating discharge temperature to control upper humidity is necessary in the given scenario because the fluctuating supply air temperature may result in increased humidity levels in the space, which can be problematic.
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Which one is correctly mentioned about specific heat?
The mass per unit volume
The amount of heat required to change the temperature of a specific volume of substance one degree
The amount of heat that must be added or removed from one pound of substance to change its temperature by one degree.
The measure of the average kinetic energy
The correct statement about specific heat is "The amount of heat required to change the temperature of a specific volume of substance one degree. "Specific heat is defined as the amount of heat energy required to increase the temperature of a unit mass of a substance by 1 degree Celsius or Kelvin.
It is a property of the substance and is dependent on factors like temperature, pressure, and composition. The specific heat is denoted by the symbol c and is expressed in units of joules per kilogram per degree Celsius (J/kg·°C). Specific heat is an essential concept in thermodynamics and plays a crucial role in heat transfer processes. The specific heat values of different substances vary widely, and they can be used to predict the thermal behavior of a substance under different conditions.The other options provided in the question are not correct statements about specific heat. Mass per unit volume is known as density and is not related to specific heat.
The amount of heat that must be added or removed from one pound of substance to change its temperature by one degree is the definition of a thermodynamic property called specific heat capacity. The measure of the average kinetic energy is known as temperature, and it is related to specific heat but is not the same thing.
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